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Title: Electronics Manufacturing : with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials by John H. Lau, C. P. Wong, Ning-Cheng Lee, S. W. Ricky Lee ISBN: 0-07-138624-6 Publisher: McGraw-Hill Professional Pub. Date: 23 August, 2002 Format: Hardcover Volumes: 1 List Price(USD): $99.50 |
Average Customer Rating: 5 (2 reviews)
Rating: 5
Summary: Outstanding book in electronics manufacturing
Comment: This is a very special book!
The focus of this book is on leadfree soldering: from chip-level interconnects, IC packaging, printed circuit board (PCB) fabrication, to PCB assemblies. It provides many useful information and engineering data related to leadfree soldering. These include: design, material selection, process development, equipment selection, manufacturing, and reliability of leadfree soldering. I found these information very useful for my job as an R&D engineer.
This book is very unique!
Even it's focus is on leadfree sodering, however, this book talks about the major problems created by leadfree soldering. These include halogen-free molding compounds for plastic packages and halogen-free epoxy resins for PCBs. This information helps me to design my electronic and photonic products so they can withstand the leadfree soldering environments.
This book is wonderful!
One of the alternatives to leadfree soldering is to use conductive adhesives. This book talks about this very important subject in great details. I enjoy very much in reading the technical contents underlining this technology.
Overall, this is a great book! I would like to recommend to everyone who is working in electronic and optoelectronic products. Hats off to the authors for writing such a comprehensive handbook on leadfree soldering. Congratulations!
Rating: 5
Summary: Just a nice Handbook on Leadfree Soldering
Comment: I like this book very much! This is the most comprehensive Handbook to leadfree soldering I have ever seen. I learned a lot from this book and it is very useful for my jobs. I carry it with me when I am at work. I open this book when I have problems, and it can always help me find the solutions. I recommend this book to all the manufacturing engineers and managers who are designing and making electronics products.
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Title: Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies by John H. Lau, Yi-Hsin Pao ISBN: 0070366489 Publisher: McGraw-Hill Professional Pub. Date: 01 September, 1996 List Price(USD): $65.00 |
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Title: Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies by Ning-Cheng Lee ISBN: 0750672188 Publisher: Newnes Pub. Date: 15 December, 2001 List Price(USD): $79.99 |
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Title: Modern Solder Technology for Competitive Electronics Manufacturing by Jennie S. Hwang ISBN: 0070317496 Publisher: McGraw-Hill Professional Pub. Date: 01 April, 1996 List Price(USD): $75.00 |
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