AnyBook4Less.com - ISBN: 0791817369 - Application of Fracture Mechanics in Electronic Packaging and Materials: Presented at the 1995 Asme International Mechanical Engineering Congress and Exposition November 12-17, 1995 Dan Francisco, California (Eep (Series), V. 11.) by International Mechanical Engineering Congress and Exposition

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Application of Fracture Mechanics in Electronic Packaging and Materials: Presented at the 1995 Asme International Mechanical Engineering Congress and Exposition November 12-17, 1995 Dan Francisco, California (Eep (Series), V. 11.)

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Title: Application of Fracture Mechanics in Electronic Packaging and Materials: Presented at the 1995 Asme International Mechanical Engineering Congress and Exposition November 12-17, 1995 Dan Francisco, California (Eep (Series), V. 11.)
by International Mechanical Engineering Congress and Exposition, William T. Chen, Raymond A. Pearson, David T. Read, Tien Y. Wu, American Society of Mechanical Engineers Electrical and Electronic Pac
ISBN: 0-7918-1736-9
Publisher: American Society of Mechanical Engineers
Pub. Date: 01 June, 1995
Format: Paperback
Volumes: 1
List Price(USD): $96.00

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