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Packaging of Electronic & Photonic Devices: Presented at the 2000 Asme International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida

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Title: Packaging of Electronic & Photonic Devices: Presented at the 2000 Asme International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida
by G. J. Kowalski, American Society of Mechanical Engineers Staff, American Society of Mechanical Engineers Electrical and Electronic Pac, International Mechanical Engineering Congress and Exposition, Symposium on mechanics
ISBN: 0-7918-1930-2
Publisher: American Society of Mechanical Engineers
Pub. Date: 01 December, 2000
Format: Paperback
Volumes: 1
List Price(USD): $100.00
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