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International Symposium on Advances in Interconnection and Packaging, Book 1, Microelectronic Interconnects and Packages: Optical and Electrical Tech (Proceedings of Spie--The International Society for Optical Engineering, V. 1389-1390.)

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Title: International Symposium on Advances in Interconnection and Packaging, Book 1, Microelectronic Interconnects and Packages: Optical and Electrical Tech (Proceedings of Spie--The International Society for Optical Engineering, V. 1389-1390.)
by Alfred P. (Edt)/ Defonzo, Alfred P./ Society of Photo-Optical Instrumentation Engineers International Symposium on Advances in Interconnection and Packaging (/ Defonzo
ISBN: 081940456X
Publisher: SPIE--The International Society for Optical Engineering
Pub. Date: April, 1991
Format: Paperback
List Price(USD): $77.00
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