| 31. 
  |  | Title: Thirteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium: Proceedings 1997 Austin, Tx, Usa, January 28-30, 1997 by IEEE, IEEE Components Packaging & Manufacturin, Institute of Electrical and Electronics
 ISBN: 078033793X
 Publisher: Institute of Electrical & Electronics Enginee
 Pub. Date: 01 January, 1997
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  |  | Title: 1997 IEEE International Conference on Innovative Systems in Silicon by IEEE Components Packaging & Manufacturin, IEEE, IEEE Computer Society
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 Pub. Date: January, 1997
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  |  | Title: Semiconductor Thermal Measurement and Management Symposium (Semi-Therm), 1998 IEEE by IEEE Components Packaging & Manufacturin, IEEE Industry Applications Society, IEEE
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 Pub. Date: 01 April, 1998
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  |  | Title: 1998 23rd IEEE - Cpmt International Electronics Manufacturing Technology Symposium by IEEE Components Packaging & Manufacturin, Institute of Electrical & Electronics En
 ISBN: 0780345231
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 Pub. Date: November, 1998
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  |  | Title: International Conference on Thermoelectrics (Ict) Proceedings by IEEE Components Packaging & Manufacturin
 ISBN: 0780354524
 Publisher: IEEE Standards Office
 Pub. Date: April, 2000
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| 36. 
  |  | Title: 1998 4th International Symposium on Advanced Packaging Materials by Packaging and Manufacturing Technology Society IEEE Components
 ISBN: 0780347951
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 Pub. Date: 01 March, 1998
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  |  | Title: Proceedings of 2nd Electronics Packaging Technology Conference: 8-10 December, 1998, Raffles City Convention Center, Singapore by Electronic Packaging Technology Conference 1998  Singapore), Lim Thiam Beng, Andrew A. O. Tay, Andrew, A. O. Tay, Thiam Beng Lim, IEEE Reliability Society, Packaging & Manufacturing Technology Society Components, IEEE electron
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| 40. 
  |  | Title: Intersociety Conference on Thermal Phenomena in Electronic Systems (I-Therm) Proceedings by IEEE Components Packaging & Manufacturin
 ISBN: 0780359135
 Publisher: IEEE Standards Office
 Pub. Date: August, 2000
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