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31.
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Cover ImageTitle: Thirteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium: Proceedings 1997 Austin, Tx, Usa, January 28-30, 1997
by IEEE, IEEE Components Packaging & Manufacturin, Institute of Electrical and Electronics
ISBN: 078033793X
Publisher: Institute of Electrical & Electronics Enginee
Pub. Date: 01 January, 1997
List Price: $102.00
Amazon.com Price: $102.00
32.
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Cover ImageTitle: 1997 IEEE International Conference on Innovative Systems in Silicon
by IEEE Components Packaging & Manufacturin, IEEE, IEEE Computer Society
ISBN: 0780342755
Publisher: Institute of Electrical & Electronics Enginee
Pub. Date: January, 1997
List Price: $96.00
Amazon.com Price: $96.00
33.
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Cover ImageTitle: Semiconductor Thermal Measurement and Management Symposium (Semi-Therm), 1998 IEEE
by IEEE Components Packaging & Manufacturin, IEEE Industry Applications Society, IEEE
ISBN: 0780344863
Publisher: Institute of Electrical & Electronics Enginee
Pub. Date: 01 April, 1998
List Price: $118.00
Amazon.com Price: $118.00
34.
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Cover ImageTitle: 1998 23rd IEEE - Cpmt International Electronics Manufacturing Technology Symposium
by IEEE Components Packaging & Manufacturin, Institute of Electrical & Electronics En
ISBN: 0780345231
Publisher: Institute of Electrical & Electronics Enginee
Pub. Date: November, 1998
List Price: $146.00
Amazon.com Price: $146.00
35.
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Cover ImageTitle: International Conference on Thermoelectrics (Ict) Proceedings
by IEEE Components Packaging & Manufacturin
ISBN: 0780354524
Publisher: IEEE Standards Office
Pub. Date: April, 2000
List Price: $172.00
Amazon.com Price: $172.00
36.
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Cover ImageTitle: 1998 4th International Symposium on Advanced Packaging Materials
by Packaging and Manufacturing Technology Society IEEE Components
ISBN: 0780347951
Publisher: Institute of Electrical & Electronics Enginee
Pub. Date: 01 March, 1998
List Price: $128.00
Amazon.com Price: $128.00
37.
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Cover ImageTitle: 1998 17th International Conference on Thermoelectrics, Ict
by Packaging and Manufacturing Technology Society IEEE Components
ISBN: 0780349075
Publisher: Institute of Electrical & Electronics Enginee
Pub. Date: 01 October, 1998
List Price: $154.00
Amazon.com Price: $154.00
38.
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Cover ImageTitle: 1998 2nd International Electronic Manufacturing Technology, Iemt/Imc
by Packaging and Manufacturing Technology Society IEEE Components
ISBN: 0780350901
Publisher: Institute of Electrical & Electronics Enginee
Pub. Date: 01 July, 1998
List Price: $138.00
Amazon.com Price: $138.00
39.
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Cover ImageTitle: Proceedings of 2nd Electronics Packaging Technology Conference: 8-10 December, 1998, Raffles City Convention Center, Singapore
by Electronic Packaging Technology Conference 1998 Singapore), Lim Thiam Beng, Andrew A. O. Tay, Andrew, A. O. Tay, Thiam Beng Lim, IEEE Reliability Society, Packaging & Manufacturing Technology Society Components, IEEE electron
ISBN: 078035141X
Publisher: Institute of Electrical & Electronics Enginee
Pub. Date: 01 December, 1998
List Price: $134.00
Amazon.com Price: $134.00
40.
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Cover ImageTitle: Intersociety Conference on Thermal Phenomena in Electronic Systems (I-Therm) Proceedings
by IEEE Components Packaging & Manufacturin
ISBN: 0780359135
Publisher: IEEE Standards Office
Pub. Date: August, 2000
List Price: $170.00
Amazon.com Price: $170.00
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