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41.
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Cover ImageTitle: Intersociety Conference on Thermal Phenomena in Electronic Systems (I-Therm) Proceedings
by IEEE Components Packaging & Manufacturin
ISBN: 0780359135
Publisher: IEEE Standards Office
Pub. Date: August, 2000
List Price: $170.00
Amazon.com Price: $170.00
42.
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Cover ImageTitle: 2000 Twenty-Sixth Ieee/Cpmt International Electronics Manufacturing Technology Symposium
by Components, Packaging Manufacturing Technology Society Staff Ieee
ISBN: 0780364821
Publisher: IEEE
Pub. Date: 01 January, 2001
List Price: $142.00
Amazon.com Price: $142.00
43.
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Cover ImageTitle: Physical and Failure Analysis of Integrated Circuits, 2001 8th International Symposium on the
by IEEE Electron Devices Society, IEEE Reliability Society, Packaging, and Manufacturing Technology Society IEEE Components
ISBN: 078036676X
Publisher: IEEE
Pub. Date: 01 September, 2001
List Price: $140.00
Amazon.com Price: $140.00
44.
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Cover ImageTitle: Advanced Packaging Materials Symposium, 2002 8th International
by Packaging, and Manufacturing Technology Society IEEE Components
ISBN: 0780374347
Publisher: Institute of Electrical & Electronics Enginee
Pub. Date: 01 March, 2002
List Price: $178.00
Amazon.com Price: $178.00
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