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Cover ImageTitle: Ceramic Substrates and Packages for Electronic Applications (Advances in Ceramics, Vol 26)
by Man F. Yan, Koichi Niwa, Henry M. O'Bryan, Wayne S. Young
ISBN: 0916094359
Publisher: The American Ceramic Society
Pub. Date: November, 1989
List Price: $88.00
Amazon.com Price: $88.00
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Cover ImageTitle: Materials in Microelectronic and Optoelectronic Packaging (Ceramic Transactions, Vol 33)
by Hung C. Ling, Koichi Niwa, Vishwa N. Shukla
ISBN: 0944904637
Publisher: The American Ceramic Society
Pub. Date: July, 1993
List Price: $74.00
Amazon.com Price: $74.00
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Cover ImageTitle: Daisan sedai robotto no shogeki : jinko chino jidai no makuaki
by Koichi Niwa
ISBN: 4767302218
Publisher: Keirin Shobåo
Pub. Date: 1985

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