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Cover ImageTitle: New Characterization Techniques for Thin Polymer Films
by Ho-Ming Tong, Luu T. Nguyen
ISBN: 0471623466
Publisher: Wiley-Interscience
Pub. Date: 30 April, 1990
List Price: $162.00
Amazon.com Price: $162.00
2.
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Cover ImageTitle: Plastic-Encapsulated Microelectronics: Materials, Processes, Quality, Reliability, and Applications
by Michael Pecht, Luu T. Nguyen, Edward B. Hakim, Michael G. Pecht
ISBN: 0471306258
Publisher: John Wiley & Sons
Pub. Date: 06 February, 1995
List Price: $225.00
Amazon.com Price: $225.00
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Cover ImageTitle: Electronic Packaging Reliability: Presented at the 1993 Asme Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 (AMD)
by Luu T. Nguyen
ISBN: 0791810356
Publisher: American Society of Mechanical Engineers
Pub. Date: January, 1993
List Price: $45.00
Amazon.com Price: $45.00

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