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Cover ImageTitle: Electronic Packaging Materials Science IX: Symposium Held December 2-5, 1996, Boston, Massachusetts, U.S.A.
by Steven K. Groothuis, Paul, S. Ho, Kenzo Ishida, Tien Wu
ISBN: 1558993495
Publisher: Material Research Society
Pub. Date: February, 2000
List Price: $71.00
Amazon.com Price: $71.00
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Cover ImageTitle: Stress-Induced Phenomena in Metallization: Second International Workshop Austin, Tx March 1993 (Aip Conference Proceedings, No 305)
by Che-Yu Li, Paul Totta, P. S. Ho, Paul Tuha
ISBN: 1563962519
Publisher: Springer Verlag
Pub. Date: December, 1994
List Price: $120.00
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Cover ImageTitle: Stress-Induced Phenomena in Metallization: First International Workshop, Ithaca, Ny, 1991 (Conference Proceedings, No. 263)
by Che-Yu Li, Paul Totta, Paul Ho
ISBN: 1563960826
Publisher: Springer Verlag
Pub. Date: November, 1997
List Price: $95.00
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Cover ImageTitle: Low Dielectric Constant Materials for IC Applications
by Paul S. Ho, Jihperng Leu, Wei William Lee
ISBN: 3540678190
Publisher: Springer Verlag
Pub. Date: 16 December, 2002
List Price: $109.00
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Cover ImageTitle: Diffusion Phenomena in Thin Films and Microelectronic Materials
by Devendra Gupta, Paul S. Ho
ISBN: 0815511671
Publisher: Noyes Publications
Pub. Date: 01 January, 1988
List Price: $129.00
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Cover ImageTitle: Stress-Induced Phenomena in Metallization: Third International Workshop (Aip Conference Proceedings, 373)
by Paul S. Ho, John Bravman, Che-Yu Li, John Sanchez
ISBN: 1563964392
Publisher: Amer Inst of Physics
Pub. Date: December, 1996
List Price: $140.00
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Cover ImageTitle: Interstellar Matter: Proceedings
by James M. Moran, Paul T.P. Ho
ISBN: 0677219105
Publisher: Taylor & Francis
Pub. Date: July, 1988
List Price: $188.00
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Cover ImageTitle: Stress Induced Phenomena in Metallization: Sixth International Workshop on Stress Induced Phenomena in Metallization, Ithaca, New York 25-27 July 2001 (Aip Conference Proceedings, 612)
by Shefford P. Baker, Matti A. Korhonen, E. Arzt, Paul S. Ho
ISBN: 073540058X
Publisher: Amer Inst of Physics
Pub. Date: April, 2002
List Price: $145.00
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Cover ImageTitle: Gradient Estimation Via Perturbation Analysis (Kluwer International Series in Engineering and Computer Science, 116)
by Paul Glasserman, Yu-Chi Ho
ISBN: 0792390954
Publisher: Kluwer Academic Publishers
Pub. Date: December, 1990
List Price: $182.00
Amazon.com Price: $182.00
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Cover ImageTitle: Electronic Packaging Materials Science V: Symposium Held November 26-29, 1990, Boston, Massachusetts, U.S.A. (Materials Research Society Symposium Proceedings, Vol 203)
by Edwin D. Lillie, Paul S. Ho, Ralph Jaccodine, Kenneth Jackson
ISBN: 155899095X
Publisher: Material Research Society
Pub. Date: June, 1991
List Price: $50.00
Amazon.com Price: $50.00
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