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11. |  | Title: Microelectronics Packaging Handbook: Technologies by Rao R. Tummala, Eugene J. Pymaszewski, Alan G. Klopfenstein, Roa Tummala, Eugene J. Rymaszewski ISBN: 0442019637 Publisher: Van Nostrand Reinhold Pub. Date: December, 1995 List Price: $99.95 Amazon.com Price: $99.95 |
| 12. |  | Title: Heat Transfer Elect Packages by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein ISBN: 0412154617 Publisher: Chapman & Hall Pub. Date: 15 February, 2001 List Price: $39.95 Amazon.com Price: $39.95 |
| 13. |  | Title: Second Level Microelect Packaging by Rao Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein, Richard Bottoms, Kay, Linee Moore ISBN: 0412154714 Publisher: Charles River Media Pub. Date: 15 February, 2001 List Price: $44.95 Amazon.com Price: $44.95 |
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