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1. |  | Title: Fundamentals of Microsystems Packaging by Rao Tummala, Rao Tummala ISBN: 0071371699 Publisher: McGraw-Hill Professional Pub. Date: 08 May, 2001 List Price: $89.95 Amazon.com Price: $77.36 |
| 2. |  | Title: Microelectronics Packaging Handbook: Subsystem Packaging (Microelectronics Packaginm Handbook, 2nd Ed, Part 3) by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein ISBN: 0412084511 Publisher: Kluwer Academic Publishers Pub. Date: January, 1997 List Price: $173.50 Amazon.com Price: $173.50 |
| 3. |  | Title: Microelectronics Packaging Handbook: Technology Drivers (Microelectronics Packaging Handbook, 2nd Ed, Pt 1) by Rao R. Tummala, Eugene J. Rytmaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski ISBN: 0412084317 Publisher: Kluwer Academic Publishers Pub. Date: 15 January, 1997 List Price: $185.00 Amazon.com Price: $185.00 |
| 4. |  | Title: Microelectronics Packaging Fund by Rao Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein ISBN: 041214901X Publisher: Kluwer Academic Publishers Pub. Date: 15 April, 2001 List Price: $97.00 Amazon.com Price: $97.00 |
| 5. |  | Title: Second Level Microelect Packaging by Rao Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein, Richard Bottoms, Kay, Linee Moore ISBN: 0412154714 Publisher: Charles River Media Pub. Date: 15 February, 2001 List Price: $44.95 Amazon.com Price: $44.95 |
| 6. |  | Title: Plastic Thin Film Ceramic Package by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein ISBN: 041215451X Publisher: Chapman & Hall Pub. Date: 15 February, 2001 List Price: $64.95 Amazon.com Price: $64.95 |
| 7. |  | Title: Microelectronic Package Wiring Electronic Design by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein ISBN: 0412154919 Publisher: Chapman & Hall Pub. Date: 15 February, 2001 List Price: $49.95 Amazon.com Price: $49.95 |
| 8. |  | Title: Introduction to Microelectronics Packaging by Rao Tummala ISBN: 0071371672 Publisher: McGraw-Hill Pub. Date: November, 2000 List Price: $59.00 Amazon.com Price: $59.00 |
| 9. |  | Title: Heat Transfer Elect Packages by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein ISBN: 0412154617 Publisher: Chapman & Hall Pub. Date: 15 February, 2001 List Price: $39.95 Amazon.com Price: $39.95 |
| 10. |  | Title: Wirebonding Microelect Packaging by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein ISBN: 0412154811 Publisher: Kluwer Academic Publishers Pub. Date: 15 February, 2001 List Price: $29.95 Amazon.com Price: $29.95 |
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