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1. |  | Title: Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies by Ning-Cheng Lee ISBN: 0750672188 Publisher: Newnes Pub. Date: 15 December, 2001 List Price: $79.99 Amazon.com Price: $79.99 |
| 2. |  | Title: Electronics Manufacturing : with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials by John H. Lau, C. P. Wong, Ning-Cheng Lee, S. W. Ricky Lee ISBN: 0071386246 Publisher: McGraw-Hill Professional Publishing Pub. Date: 23 August, 2002 List Price: $99.50 Amazon.com Price: $84.57 |
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